Ball Grid Array (BGA) assembly technology is a surface mount packaging technology applied to integrated circuits, which is often used to permanently fix devices such as microprocessors. BGA assembly can accommodate more pins than other packages such as Dual in-line packages or Quad Flat Packages, and the entire bottom surface of the device can be used as pins , instead of only peripherals available, and also have a shorter average wire length than peripheral-limited package types for better high-speed performance.
Our BGA assembly services cover a wide range, including BGA prototype development, BGA PCB assembly, BGA component removal, BGA replacement, BGA rework and reballing, BGA PCB assembly inspection, and so on. Leveraging our full-coverage services, we can help customers streamline the supply network and accelerate product development time.
https://www.hitechpcba.com/bga-pcb-assembly
https://hitechcircuits.com/pcb-assembly/printed-circuit-board-assembly-services/
https://twitter.com/Roger_PCB_PCBA
https://www.facebook.com/luo.roger.1675/
https://www.instagram.com/roger_hitechpcb_pcba/
https://www.linkedin.com/in/roger-luo-hitechpcb-pcba-manufacturing-96836a7b/
Yüklenen içerik bu yeni oluşturulan albüme taşınacak. Bu albümü daha sonra düzenlemek isterseniz Hesap oluştur veya Giriş gerekir.
