Flip Chip Epoxy

0 Following 0 obserwujących

DeepMaterial Chip Underfill Adhesive series are one component, heat curable materials. The materials have been optimized for capillary underfill and reworkability. These epoxy based materials can be dispensed on the edges of the BGA, CSP or Flip Chip devi

0 grafiki 0 albumy 0

Flip polubień

Nie ma tutaj nic do wyświetlenia.

Edit or resize any image by clicking the image preview
Edit any image by touching the image preview
Wysyłanie 0 grafika (0% zakończono)
The queue is being uploaded, it should take just a few seconds to complete.
Wysyłanie zakończone
Uploaded content added to . You can utwórz nowy album with the content just uploaded.
Uploaded content added to .
You can utwórz nowy album with the content just uploaded. You must utwórz konto or zaloguj to save this content into your account.
No grafika have been uploaded
Some errors have occurred and the system couldn't process your request.
    Zaloguj to be able to create private albums and delete images after upload.
    lub anulujanuluj pozostałe
    Informacja: część grafik nie może zostać wysłana. dowiedz się więcej
    Sprawdź raport błędu, aby uzyskać więcej informacji.
    JPG PNG BMP GIF WEBP 50 MB
    resetuj zamknij anuluj anuluj pozostałe